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IEC 62912-2 Ed. 1.0 en:2019 Railway applications - Direct current signalling monostable relays - Part 2: Spring type relays standard by International Electrotechnical Commission,...
IEC 62909-2 Ed. 1.0 b:2019 Bi-directional grid-connected power converters - Part 2: Interface of GCPC and distributed energy resources standard by International Electrotechnical...
IEC 62047-33 Ed. 1.0 en:2019 Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device standard by International Electrotechnical...
IEC 62899-204 Ed. 1.0 b:2019 Heat-shrinkable low and medium voltage moulded shapes - Part 3: Specification for individual materials - Sheet 103: Heat-shrinkable, polyolefin, conductive moulded shapes for medium voltage applications
IEC/TR 63074 Ed. 1.0 en:2019 Safety of machinery - Security aspects related to functional safety of safety-related control systems standard by International Electrotechnical Commission...
IEC 60749-18 Ed. 2.0 b:2019 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) standard by International Electrotechnical...
IEC 61156-11 Ed. 1.0 en:2019 Multicore and symmetrical pair/quad cables for digital communications - Part 11: Symmetrical single pair cables with transmission characteristics up to 600 MHz - Horizontal floor wiring - Sectional specification
IEC 63068-1 Ed. 1.0 en:2019 Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects standard by
IEC 63068-2 Ed. 1.0 en:2019 Semiconductor devices ¿¿¿ Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection
IEC 63093-13 Ed. 1.0 b:2019 Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 13: PQ-cores standard by International Electrotechnical Commission,...
IEC/TR 61189-5-506 Ed. 1.0 en:2019 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the...
IEC 62899-502-2 Ed. 1.0 en:2019 Printed electronics - Part 502-2: Quality assessment - Organic light emitting diode (OLED) elements - Combined mechanical and environmental stress test methods for flexible OLED elements
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