BS IEC 62047-36:2019

BS IEC 62047-36:2019 Semiconductor devices. Micro-electromechanical devices. Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

standard by British Standard / International Electrotechnical Commission, 04/24/2019

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Scope: This part of IEC 62047 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under electrical stress, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of converse piezoelectric properties in piezoelectric thin films formedprimarily on silicon substrates, i.e., piezoelectric thin films used as actuators.

This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.

Cross References:
IEC 60068-2-14:2009
IEC 62047-30
IEC 60384-1:2016


All current amendments available at time of purchase are included with the purchase of this document.

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