Full Description

This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixedtechnology.

The Standard defines acceptance and rejection criteria for high-reliability manufacture of surface-mount and mixed-technology circuit assemblies intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight.

The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work.

The assembly of leaded devices to through-hole terminations and general soldering principles are covered in ECSS-Q-ST-70-08.

Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-10, ECSS-Q-ST-70-11 and ECSS-Q-ST-70-12 . The mounting and supporting of devices, terminals and conductors prescribed herein applies to assemblies at PCB level designed to continuously operate over the mission within thetemperature limits of -55

Product Details

Published: 05/03/2019 ISBN(s): 9780539003956 Number of Pages: 154 File Size: 1 file , 5.5 MB Product Code(s): 30375180, 30375180, 30375180 Note: This product is unavailable in United Kingdom