BS IEC 62047-31:2019

BS IEC 62047-31:2019 Semiconductor devices. Micro-electromechanical devices. Four-point bending test method for interfacial adhesion energy of layered MEMS materials
standard by British Standard / International Electrotechnical Commission, 04/17/2019

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Full Description

BS IEC 62047-31:2019 specifies a four-point bending test method for measuring interfacialadhesion energy of the weakest interface in the layered micro-electromechanical systems(MEMS) based on the concept of fracture mechanics. In a variety of MEMS devices, there aremany layered material interfaces, and their adhesion energies are critical to the reliability ofthe MEMS devices.

Cross References:
IEC 62047-2:2006
IEC 62047-3:2006

All current amendments available at time of purchase are included with the purchase of this document.

Product Details

Published: 04/17/2019 ISBN(s): 9780580966606 Number of Pages: 14 File Size: 1 file , 1.5 MB Product Code(s): 30352563, 30352563, 30352563 Note: This product is unavailable in United Kingdom