IEEE 1301.3 : 1992
IEEE 1301.3 : 1992
METRIC EQUIPMENT PRACTICE FOR MICROCOMPUTERS - CONVECTION-COOLED WITH 2.5 MM CONNECTORS
Institute of Electrical & Electronics Engineers
METRIC EQUIPMENT PRACTICE FOR MICROCOMPUTERS - CONVECTION-COOLED WITH 2.5 MM CONNECTORS
Institute of Electrical & Electronics Engineers
1 Overview
1.1 Scope
1.2 Purpose
1.3 Dimensions
1.4 Coordination dimensions
1.5 Environmental requirements
1.6 Conformance with this standard
2 References
3 Word usage, definitions, and abbreviations
3.1 Special word usage
3.2 Definitions
3.3 Abbreviations
4 Dimensional nomenclature
4.1 Dimensional location nomenclature
4.2 Dimensional nomenclature, heights
4.3 Dimensional nomenclature, widths
4.4 Dimensional nomenclature, depths
4.5 Dimensional nomenclature, mounting pitches
5 General arrangements
6 Subracks
7 Backplane design and mounting positions
7.1 Rigidity
7.2 Dimension
8 Plug-in units
Annex A (informative) Tolerances with 2.5 mm connector and
IEEE 1301metric equipment
Describes details for subracks, plug-in-units, printed boards, and backplanes to be used in conjunction with IEEE Std 1301 and a 2.5 mm connector in accordance with IEC 48B.
Document Type | Standard |
Status | Current |
Publisher | Institute of Electrical & Electronics Engineers |