IEEE 1301.3 : 1992

IEEE 1301.3 : 1992

METRIC EQUIPMENT PRACTICE FOR MICROCOMPUTERS - CONVECTION-COOLED WITH 2.5 MM CONNECTORS

Institute of Electrical & Electronics Engineers

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Table of Contents

1 Overview
  1.1 Scope
  1.2 Purpose
  1.3 Dimensions
  1.4 Coordination dimensions
  1.5 Environmental requirements
  1.6 Conformance with this standard
2 References
3 Word usage, definitions, and abbreviations
  3.1 Special word usage
  3.2 Definitions
  3.3 Abbreviations
4 Dimensional nomenclature
  4.1 Dimensional location nomenclature
  4.2 Dimensional nomenclature, heights
  4.3 Dimensional nomenclature, widths
  4.4 Dimensional nomenclature, depths
  4.5 Dimensional nomenclature, mounting pitches
5 General arrangements
6 Subracks
7 Backplane design and mounting positions
  7.1 Rigidity
  7.2 Dimension
8 Plug-in units
Annex A (informative) Tolerances with 2.5 mm connector and
                      IEEE 1301metric equipment

Abstract

Describes details for subracks, plug-in-units, printed boards, and backplanes to be used in conjunction with IEEE Std 1301 and a 2.5 mm connector in accordance with IEC 48B.

General Product Information

Document Type Standard
Status Current
Publisher Institute of Electrical & Electronics Engineers

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