IPC 4552-WAM1-2

IPC 4552-WAM1-2 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2

standard by Association Connecting Electronics Industries, 12/01/2012

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In answer to numerous industry requests for guidance on electroless nickel/immersion gold (ENIG), IPC-4552 was developed. Containing full color photographs, this specification sets the requirements for the use of ENIG as a surface finish for printed boards. It includes requirements for ENIG deposit thicknesses based on performance criteria. It is an invaluable resource for use by suppliers, board fabricators, electronics manufacturing service (EMS) providers and original equipment manufacturers (OEMs). The specification's Appendix also includes a FREE copy of the highly sought-after technical paper, "Standard Developments Efforts of Electroless Nickel Immersion Gold," by George Milad and Gerard O'Brien. The ENIG board surface finish is an electroless nickel layer capped with a thin layer of immersion gold. The immersion gold protects the underlying nickel from oxidation or passivation over its intended life. It is a multifunctional surface finish, applicable to soldering, aluminum wire bonding, press fit connections, and as a contact surface. The addition of Amendments 1

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Published: 12/01/2012 ISBN(s): 9781611930764 Number of Pages: 40File Size: 1 file , 20 MB

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