IPC 6012D-AM1

IPC 6012D-AM1 Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1

standard by Association Connecting Electronics Industries, 09/01/2017

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The IPC-6012D-AM1 makes changes to the existing acceptance criteria for copper wrap plating measurements as defined by IPC-6012D. The IPC-6012D-AM1 implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after January 01, 2018), so as not to impose onto legacy designs any additional qualification activity associated with adopting acceptance requirements proven on newer designs. The IPC-6012D-AM1 is not applicable to legacy product that will remain subject to IPC-6012D copper wrap plating requirements.

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