Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision D incorporates resistance requirements to lead free soldering processes.
Product Details
Published: 04/01/2007 ANSI: ANSI Approved Number of Pages: 16File Size: 1 file , 260 KB
