IPC J-STD-003A
IPC J-STD-003A Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 02/01/2003
Full Description
IPC/EIA J-STD-003A provides industry-recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated-through holes. This revision includes a significant change in the type of flux required to be used for solderability testing. Test methods covered include edge dip, rotary dip, solder float, wave solder and wetting balance. Produced by IPC and EIA. Supersedes J-STD-003.Cart
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Specials
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SAE AS 22759/90 : 2015
$78.00 (-40%) $46.80