IPC 2222

IPC 2222 Sectional Standard on Rigid PWB Design

standard by Association Connecting Electronics Industries, 03/01/1998

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Establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single, double or multi-layered boards. Key concepts in this document are: rigid laminate properties, designer/end user materials section map, and scoring parameters. This document should be used in conjunction with IPC- 2221.

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