Establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single, double or multi-layered boards. Key concepts in this document are: rigid laminate properties, designer/end user materials section map, and scoring parameters. This document should be used in conjunction with IPC- 2221.
Product Details
Published: 03/01/1998 Number of Pages: 24File Size: 1 file , 900 KB Product Code(s): 2222(D)1