IPC 6015
IPC 6015 Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
standard by Association Connecting Electronics Industries, 02/01/1998
Full Description
This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011.Cart
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Specials
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AS 1684.2 N1/N2 Supp 6-2010
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