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IPC SM-784

IPC SM-784 Guidelines for Chip-on-Board Technology Implementation

standard by Association Connecting Electronics Industries, 11/01/1990

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Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques.

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Published: 11/01/1990 Number of Pages: 37File Size: 1 file , 440 KB Product Code(s): SM-784(D)1

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