IPC DD-135
IPC DD-135 Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
standard by Association Connecting Electronics Industries, 08/01/1995
Full Description
This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.Cart
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Specials
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SAE AS 644B : 2011(S2018)
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