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IPC DD-135

IPC DD-135 Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

standard by Association Connecting Electronics Industries, 08/01/1995

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This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.

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Published: 08/01/1995 Number of Pages: 36File Size: 1 file , 370 KB Product Code(s): DD-135(D)1

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