IPC J-STD-003
IPC J-STD-003 Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/1992
Full Description
Contains industry-recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated through-holes. Test methods covered include edge dip, rotary dip, solder float, wave solder and wetting balance.Cart
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Specials
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AS 2508.10.001-2000
$39.53 (-57%) $17.00