Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements.
Product Details
Published: 01/10/1987 Number of Pages: 66File Size: 1 file , 550 KB Product Code(s): HM-860(D)1
