IPC J-STD-033D
IPC J-STD-033D Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
standard by Association Connecting Electronics Industries, 03/01/2018
Full Description
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.Cart
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Specials
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AS ISO 15489.2-2002 (R2013)
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